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Applications
Wafer defect inspection, wafer dicing, precision manufacturing and packaging, laser marking, microscopy, or scanning in the semiconductor field.
Travel of the ABG series stage can be customized according to customer requirements. It can also be combined with Z lift stages and θ rotary tables to form X-Y-Z-θ multi-axis systems.
Optional Accessories
Control system (an integrated drive-control controller or a driver and linear actuator may be optionally configured).
Encoder (incremental or absolute types available).
Filtration system (an FRL air treatment unit shall be configured; the air must be clean and dry, with particles filtered to below 0.5μm).
Base and vibration isolation system (a granite base and vibration isolation system may be additionally configured).
Customized according to customer requirements; can be combined with Z-lift stages and θ rotary tables to form an X-Y-Z-θ multi-axis system.
Technical specifications | Unit | MKN-ABG-400/500 | MKN-ABG-500/750 | MKN-ABG-800/1000 |
Load capacity *3 | Kg | 25 | 25 | 25 |
Effective travel | mm | X:400 Y:500 | X:500 Y:750 | X:800 Y:1000 |
Continuous thrust | N | X:360 Y:960 | X:360 Y:960 | X:360 Y:1100 |
Peak thrust | N | X:1700 Y:4600 | X:1700 Y:4600 | X:1700 Y:5400 |
Resolution*5 | nm | 1 | 1 | 1 |
Minimum step *5 | nm | 10 | 10 | 10 |
Repeatability*4 | um | ±0.15 | ±0.15 | ±0.2 |
Positioning accuracy (after compensation)*4 | um | ±0.3 | ±0.3 | ±0.5 |
Maximum speed (unloaded)*2 | mm/s | 1000 | 1000 | 500 |
Maximum acceleration (unloaded)*2 | g | 2 | 2 | 0.75 |
Straightness*1 | um | ±0.3 | ±0.5 | ±0.5 |
Flatness*1 | um | ±0.5 | ±0.75 | ±1 |
Pitch*1 | arcsec | ±1 | ±1 | ±1.5 |
Yaw*1 | arcsec | ±0.5 | ±0.5 | ±1 |
Working air pressure | Mpa | 0.4~0.55 | 0.4~0.55 | 0.4~0.55 |
(1) Depends on the flatness of the stage mounting surface, load weight, orientation, and external forces applied to the stage.
(2) Limited by the payload, controller, or driver.
(3) The effective payload center of gravity is assumed to be positioned at the center within 50 mm above the motion stage. The stage is designed for horizontal operation only.
(4) Accuracy may be improved through controller error compensation. To achieve these values, the stage must be purchased together with the controller. Accuracy values are based on short-term measurements and do not consider the long-term effects of thermal drift on the stage. The measurement ambient temperature is 22 ℃ ± 0.5 ℃, and ambient vibration shall meet VC-C standard or above.
(5) Incremental or absolute encoders may be optionally selected according to actual requirements. Resolution shall be subject to the actual configuration selected, and the minimum step size is determined according to the resolution.
(6) To prevent insufficient air pressure, installation of a pressure switch is recommended, and the signal shall be input to the Emergency Stop (E-STOP) port of the motion controller.
(7) Customized special specifications and materials may be provided according to customer requirements.
